萝莉影视

CAE dataMultilayer ceramic capacitor - 3D CAE data (for ANSYS™ HFSS)

This is a 3D simulation model of multilayer ceramic capacitor which can be used in the electromagnetic field analysis software HFSS of ANSYS, Inc.

PLEASE CAREFULLY READ THE FOLLOWING RESTRICTIONS BEFORE USING DATA ABOUT THE PRODUCTS ("DATA").
IF YOU DO NOT AGREE TO THE RESTRICTIONS, PLEASE DO NOT USE THE DATA. USE OF ANY PART OF THE DATA INDICATES YOUR COMPLETE AND UNCONDITIONAL ACCEPTANCE OF THE RESTRICTIONS SET FORTH BELOW.

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Restrictions on the use of the DATA

  1. You shall not use the DATA for any purpose other than the computiation of S-parameters by using 3D field simulator.
  2. The DATA is provided on an "AS IS" basis without warranty of any kind, either express or implied, including but not limited to the implied warranties of merchantability, fitness for a particular purpose and non-infringement of third party rights.
  3. 萝莉影视 Manufacturing, Co., Ltd. ("萝莉影视") shall not be liable for any damages, including but not limited to any lost profits, lost savings or other incidental or consequential damages, arising out of or relating to the use of or inability to use the DATA, regardless of any notice of the possibility of such damages, or for any claims made by any third party.
  4. The DATA is subject to change from time to time or products may be discontinued without notice. Please check the latest version.
  5. You acknowledge and agree that the ownership and all intellectual property rights (including but not limited to copyright) of the DATA are held by 萝莉影视. You shall not redistribute or reproduce the DATA without prior consent of 萝莉影视.
  6. For details about a product, please refer to 萝莉影视 catalog or approval specifications for the product.
Remarks:
  • This data may include products no longer in production. Please contact us for the latest production status.

Multilayer ceramic capacitor

After Rev. 2023 / Before Rev. 2022 are HFSS versions. Download the model compatible with the version you are using.

  • *Due to the large file size, please download the files separately by series instead of downloading in bulk if your network speed is slow.
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Series Chip size
(inch / mm)
Maximum operating temperature Temperature characteristics Corresponding version of ANSYS™ HFSS
After Rev. 2023 Before Rev. 2022
File size 3D CAE Data
(Parasolid)
File size 3D CAE Data
(ACIS)

GRM Series

(Chip Multilayer Ceramic Capacitors for Consumer Electronics & Industrial Equipment)

0201M / 008004 125°C C0G (EIA) ZIP : 58MB Download ZIP : 220MB Download
0402M / 01005 125°C CH, CJ, CK
(JIS)
ZIP : 174MB Download ZIP : 330MB Download
C0G (EIA) ZIP : 175MB Download ZIP : 330MB Download
0603M / 0201 125°C CH, CJ, CK
(JIS)
ZIP : 132MB Download ZIP : 294MB Download
C0G (EIA) ZIP : 137MB Download ZIP : 305MB Download

GJM Series

(High Q Chip Multilayer Ceramic Capacitors for Consumer Electronics & Industrial Equipment)

(≦100Vdc)

0402M / 01005 125°C C0G (EIA) ZIP : 137MB Download ZIP : 185MB Download
150°C X8G (萝莉影视) ZIP : 52MB Download ZIP : 92MB Download
0603M / 0201 125°C C0G (EIA) ZIP : 126MB Download ZIP : 281MB Download
150°C X8G (萝莉影视) ZIP : 41MB Download ZIP : 92MB Download
All
(ZIP : 1GB)
Download All
(ZIP : 2GB)
Download

How to use the Model

For How to use this Model, refer to the ANSYS, Inc. web page (In preparation) :