- High temperature wire-bondable capacitor up to 250°C
- The ETSC and EXSC series are designed to be compliant with high temperature wire bond technologies with Aluminum pads for Aluminum wedge bonding and gold pads on request for gold wire bonding. These capacitors feature low profile (250?m), low leakage current and high operating temperature (ETSC up to 200°C/ EXSC up to 250°C) with high stability with temperature, voltage and negligible capacitance loss through aging. Applications include downhole industries, decoupling, filtering, charge pump, replacement of X8R and C0G dielectrics, and high reliability applications, mainly for Multi-Chip Module assemblies.