2. Square shape
The square shape allows for maximum capacity acquisition with a minimum number of BGA balls removed.
3. Ultra-low profile
Ultra-low profile lineup such as 90um height MAX is available and can be mounted between narrow BGA balls.
4. AEC-Q200 qualified
In the automotive market, low-ESL chip multilayer ceramic capacitors are getting to be used for decoupling the power supply of processors, due to the increasing functionality and multifunctionality of automotive devices such as IVI, and the demand for higher performance processors and smaller devices.
The series is designed for use in car multimedia, car interiors, car comfort applications and general electronics. Therefore, it should not be used in critical applications for passenger safety or for vehicle drive functions (e.g. ABS, airbags, etc.).