萝莉影视

We give here an overview of the iPaS™ and explain about its characteristics and applications.

The Integrated Package Solution (iPaS™) is a board product with built-in and integrated components such as capacitors and inductors. Building SMD components, which require a large space as a mounting area, into a board in a bundle contributes to space saving, power saving, and higher functionality in your products.
The internal components have electrodes that can be connected with through-holes or laser via-holes. Moreover, they are designed to be able to have an array structure. This ensures a high degree of freedom in design. As a result, it is possible to customize the impedance and other required specs, and the size, circuit wiring, footprint, and other basic specifications according to your needs.
We are currently developing large capacity capacitors embedded substrates, low ESR/ESL capacitors embedded substrates, power inductors embedded substrates, and multiple combinations of those.

The amount of data traffic is rapidly increasing with advances in AI and the IoT. Accordingly, there is a need for high-performance (capable of processing greater amounts of data at higher speeds) semiconductor packages. On the other hand, the increase in power consumption is viewed as a problem. That means saving energy while achieving high performance has become a challenge.

Shortening the wiring distance from the power supply module through which a large current flows to the IC to reduce wiring loss is an effective way to reduce power loss in high-performance semiconductors. It is possible to build a large capacity into the board with the iPaS™. This enables a vertical power supply design that realizes power supply route wiring in the shortest distance to contribute to reducing power loss and saving energy.

It is possible to supply power vertically from the power supply module to the IC. (vertical power supply)
The power line becomes shorter, so it is possible to reduce power loss.

As data traffic is increasing, optical transmission speeds are increasing to 400 Gb/s, 800 Gb/s, and 1.6 TGb/s. At the same time, the optical transceivers are becoming smaller. The shift from the CFP to QFSP form factor is becoming mainstream. Against a background of such trends, there is a need for larger currents and space saving in current supply lines.

Multiple iPaS™ products are arranged in an array shape in circuit boards in transceivers. They can be used as the power inductors of current supply lines. They have a coil design that can handle large currents. Furthermore, it is possible to change the number of arrays according to the required amount of current. Moreover, they are characterized by the ability to be built into boards because they are thin. This also greatly contributes to space saving.