萝莉影视

Capacitors/Inductors embedded substrates (iPaS™)

[Reference product] *The product specifications and appearance are subject to change without notice.

The Integrated Package Solution (iPaS™) is a board product with built-in and integrated components such as capacitors and inductors. It is possible to customize the internal component specifications and board layout according to your needs. In addition, this product is capable of handling large currents of several tens of amperes or more. It is used mainly for power supply line and high-performance semiconductor packages.

Capacitors/Inductors embedded substrates

Video

We give here an overview of the iPaS™ and explain about its characteristics and applications.

萝莉影视overview

The Integrated Package Solution (iPaS™) is a board product with built-in and integrated components such as capacitors and inductors. Building SMD components, which require a large space as a mounting area, into a board in a bundle contributes to space saving, power saving, and higher functionality in your products.
The internal components have electrodes that can be connected with through-holes or laser via-holes. Moreover, they are designed to be able to have an array structure. This ensures a high degree of freedom in design. As a result, it is possible to customize the impedance and other required specs, and the size, circuit wiring, footprint, and other basic specifications according to your needs.
We are currently developing large capacity capacitors embedded substrates, low ESR/ESL capacitors embedded substrates, power inductors embedded substrates, and multiple combinations of those.

Capacitors embedded substrates (Capacitor Type iPaS™)

Applications

Realization of vertical power supply design for power supply lines and high-performance semiconductor packages

Main markets
Servers, Base stations, etc.

The amount of data traffic is rapidly increasing with advances in AI and the IoT. Accordingly, there is a need for high-performance (capable of processing greater amounts of data at higher speeds) semiconductor packages. On the other hand, the increase in power consumption is viewed as a problem. That means saving energy while achieving high performance has become a challenge.

Shortening the wiring distance from the power supply module through which a large current flows to the IC to reduce wiring loss is an effective way to reduce power loss in high-performance semiconductors. It is possible to build a large capacity into the board with the iPaS™. This enables a vertical power supply design that realizes power supply route wiring in the shortest distance to contribute to reducing power loss and saving energy.

Application example
AI accelerator

It is possible to supply power vertically from the power supply module to the IC. (vertical power supply)
The power line becomes shorter, so it is possible to reduce power loss.

Current GPU structure
Future GPU Board structure
(vertical power supply)

Features

Low-impedance board with built-in large-capacity aluminum electrolytic capacitors

  • It is possible to significantly reduce board impedance by building a large-capacity aluminum electrolytic capacitor into the board.
  • It is possible to significantly reduce the number of MLCCs on the surface of the board. This can realize space saving.
Image of board
Graph of impedance

Forms a through-hole inside the capacitor

  • Equipped with a through-hole for large current, this structure is suitable for supplying current in the vertical direction.
  • The through-hole and capacity part are directly connected inside the product. This makes it possible to reduce the wiring inductance component.
Structure diagram of capacitor

Compatible with both power supply module boards and package boards

  • This product can be applied to boards for both power supply modules and packages. That means it is possible to reduce the impedance over a wide bandwidth. Therefore, it can be used in total vertical power supply design.

Inductors embedded substrates (Inductor Type iPaS™)

Applications

Contributes to larger currents and space saving in high-speed transmission optical transceivers

As data traffic is increasing, optical transmission speeds are increasing to 400 Gb/s, 800 Gb/s, and 1.6 TGb/s. At the same time, the optical transceivers are becoming smaller. The shift from the CFP to QFSP form factor is becoming mainstream. Against a background of such trends, there is a need for larger currents and space saving in current supply lines.

Multiple iPaS™ products are arranged in an array shape in circuit boards in transceivers. They can be used as the power inductors of current supply lines. They have a coil design that can handle large currents. Furthermore, it is possible to change the number of arrays according to the required amount of current. Moreover, they are characterized by the ability to be built into boards because they are thin. This also greatly contributes to space saving.

Image of optical transceivers

Features

Power inductors embedded substrates

  • A process that forms a mount board is used, so it is thin and offers outstanding freedom of coil design.
  • It is possible to select the optimal L value for the power IC due to this high design freedom. This maximizes the potential of your power supply while contributing to a reduction in the mounting area.
Image of board
  • It is possible to obtain the desired inductance characteristics by laying the coil units on the same plane to turn it into an array.
  • This achieves DC superposition characteristics*1 of 10 A or more while being built into the board.
  • *1The allowable current value is determined from the magnetic characteristics. It is defined as the value at which there is a drop of 30% from the initial inductance.
Graph 1
Graph 2