腿栓唹篇

シリコンキャパシタ┘轡螢灰鵐灰鵐妊鵐毅Protection Devices

HB LED Submounts

腿栓唹篇Description

腿栓唹篇 offers two different submounts for HB LED applications:

  • Silicon submount with integrated ESD protection and superior thermal management
  • Ceramic submount with side mounted TVS diode.
    Custom designs can be developed under request.

Key Benefits

  • Very low leakage current
  • Up to 100 V breakdown voltage
  • Superior thermal resistance
  • Improve reflectivity
  • Very small form factor
  • Extended temperature range

Key Features

  • Very low leakage current, less than 1 ?A
  • Up to 100 V breakdown voltage available
  • Very small form factor
  • Large choice of back-end metallization for compliance with HB LED assembly

Other Protection Devices

腿栓唹篇Description

Thanks to our proven skill in the development of ESD protection, any customized solution can be developed and combined with other components such as resistors, capacitors and inductors as well as thermal and photo sensors.

Key Benefits

  • Advanced ESD protection device
  • Huge size reduction by integrating tens of components in a single die
  • High reliability compared with external SMD solution

Key Features

  • Compliant with embedded die in PCB
  • Up to 100 V breakdown voltage
  • Large choice of back-end metallization for compliance with HB LED assembly
  • Very low leakage current for longer battery operation